BGA Rework Services
On the cutting edge of technology, we offer a full line of BGA rework,
and repair
services to assist contract manufacturers, product research and developers.
Quick turn around times to help get your product to market on time.
BGA Rework
Installation and exchanging of BGA components is performed automatically using
an SRT/Summit 1100 Rework System. The SRT is fully capable of installing all
size packages including Micro BGA. All components are X-Ray inspected using a
Nicolet Imaging System. A video of
the finished solder joint with
commentary is emailed to the customer for all BGA component rework.
BGA Pad Repair
Includes repair or replacement of damaged BGA pads and related traces. Repairs can
be made both on circuit board pads and component pads.
Rework, Repair, Modification
We provide solutions to the largest contract manufacturers and product development
companies in the world. Surface mount and BGA pad repair, circuitry modification,
inner-layer repairs on complex multi-layer boards and
much more.
Training & Consulting
We provide training, certification, and consulting services
in the area's of BGA Component Rework & Process Implementation, Lead & Lead
Free Hand Soldering, Circuit Board Rework & Repair, Manufacturing Process
Problems, Quality Improvement, and more!
X ray Inspection
X-Ray inspection using a Nicolet Imaging System. Inspect BGA and surface mount components
for hidden bridges. Inspect circuit boards for inner layer shorts and opens.
Precision PCB
Services, Inc. The only BGA Rework Company that is referenced in the
Xilinx Document XAPP426, "Implementing Xilinx Flip-Chip BGA Packages.
http://www.xilinx.com/bvdocs//appnotes/xapp426.pdf
